Interfacial Reaction and Wettability of 72Ag-28Cu Braze on CP-Ti Substrate Using Infrared Heating

摘要

Reactive wetting by infrared heating of a BAg-8 braze on a CP-Ti substrate is achieved at 1073 K (800 °C) for 300 seconds. Increasing the test temperature from 1073 K to 1123 K (800 °C to 850 °C) results in great improvement of the wettability on the CP-Ti substrate due to the lower melt viscosity at higher test temperature and the alloying effect of Cu into the CP-Ti substrate to form the interfacial eutectoid layer.