MCM Technology by Flip-Chip Mounting for Super Small Visual Radio VR-01

摘要

For miniaturization and higher function of portable audio products, high-density mounting technology for ICs is indispensable. The MCM(Multi Chi Module) with resin substrate has been developed using an original SBB (Stud-Bump Bonding) technology of our company. For high-quality MCM manufacturing, stress caused by the difference in thermal expansion between the IC and the resin substrate has been reduced by optimizing the transfer volume of conductive paste and lowering the temperature of conductive paste curing process. Also, a self-test system has been developed by mounting on the MCM a bare chip of microcomputer with test program built-in. Thus, the super-small visual radio (VR-01) with FM multiplex MCM, which is the smallest and thinnest in the industry, has been realized.