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机译:活性元素Ti对Sn3.5Ag4Ti(Ce,Ga)合金钎料焊接SiO_2 / SiO_2接头的界面组织和结合强度的影响
College of Electronic Engineering, South China Agricultural University, Wushan R. D., Tianhe District, Guangzhou 510642, China;
College of Physics and Information Science, Hunan Normal University, LuShan R, D., Yuelu District, Changsha 410081, China;
China Electronic Product Reliability and Environmental Testing Research Institute, Dongguanzhuang R. D., Tianhe District, Guangzhou 510610, China;
College of Electronic Engineering, South China Agricultural University, Wushan R. D., Tianhe District, Guangzhou 510642, China;
School of Electronic and Information Engineering, South China University of Technology, Wushan R. D., Tianhe District, Guangzhou 510641, China;
Intermetallics; Bonding; Interfaces; Fracture;
机译:活性元素Ti对Sn3.5Ag4Ti(Ce,Ga)合金填料与Si基体之间界面反应和焊接强度的影响
机译:钛对Sn3.5Ag4Ti(Ce,Ga)合金填料与氧化铝之间活性键合的影响
机译:Si / Si与Sn3.5Ag4Ti(Ce,Ga)合金填料的新型低温活性键合
机译:钛对SN3.5AG4TI(CE,GA)合金填料与GaAs底物的活性键合的影响
机译:关于无铅焊点的微观结构:对加速热循环和有限元建模的意义
机译:焊接工艺和间隙距离对Ni-Cr合金焊接接头抗拉强度的影响
机译:氮化铝和含有各种活性元素的氮化银与银钎料金属之间的界面微结构和粘合强度
机译:使用贵金属镀层的扩散层和焊接Ti接头的强度(Diffuzionnye sloi i prochnost'payanykh soedinenii Titana s primeneniem Gal'vanopokrytii Blagorodnykh metallov)