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首页> 外文期刊>Materials and Manufacturing Processes >Micromold-Based Laser Shock Embossing of Metallic Foil: Fabrication of Large-Area Three-Dimensional Microchannel Networks
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Micromold-Based Laser Shock Embossing of Metallic Foil: Fabrication of Large-Area Three-Dimensional Microchannel Networks

机译:金属箔基于微模的激光冲击压印:大面积三维微通道网络的制造

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摘要

Micromold-based laser shock embossing is a new three-dimensional (3D) forming technique, which utilizes laser-generated shock wave to shape the workpiece. In this article, the microchannel networks mold was produced by micro-wire electrical discharge machining (Micro-WEDM). Large-area three-dimensional microchannel networks were successfully fabricated on metallic foil surface using laser-generated shock wave. The investigation reveals that 3D microchannel networks have a high spatial resolution at the micron level. The fracture in the forming experiment was also detected. The fabrication cost is independent of the microstructures complexity. Therefore, micromold-based laser shock embossing holds promise for achieving precise, well-controlled, low-cost, high efficiency of 3D metallic microstructures.View full textDownload full textKeywordsDeformation, Embossment, Energy, Forming, Laser, Metalforming, Micromachining, MicromanufacturingRelated var addthis_config = { ui_cobrand: "Taylor & Francis Online", services_compact: "citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,more", pubid: "ra-4dff56cd6bb1830b" }; Add to shortlist Link Permalink http://dx.doi.org/10.1080/10426914.2010.532528
机译:基于微模具的激光冲击压花是一种新的三维(3D)成型技术,该技术利用激光产生的冲击波对工件进行成型。在本文中,微通道网络模具是通过微丝放电加工(Micro-WEDM)生产的。利用激光产生的冲击波成功地在金属箔表面上制造了大面积的三维微通道网络。调查显示3D微通道网络在微米级别具有很高的空间分辨率。在成型实验中也发现了断裂。制造成本与微结构的复杂性无关。因此,基于微模具的激光冲击压印有望实现精确,受控良好,低成本,高效率的3D金属微结构。查看全文下载全文关键字变形,压花,能量,成型,激光,金属成型,微加工,微制造相关var addthis_config = {ui_cobrand:“ Taylor&Francis Online”,servicescompact:“ citeulike,netvibes,twitter,technorati,delicious,linkedin,facebook,stumbleupon,digg,google,更多”,发布:“ ra-4dff56cd6bb1830b”};添加到候选列表链接永久链接http://dx.doi.org/10.1080/10426914.2010.532528

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