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Influence of surfactants treatment on silver powder and its thick films

机译:表面活性剂处理对银粉及其厚膜的影响

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Thick film pastes have very high viscosities to retain the particles in suspension. The effects of surfactant treatment and the particle size of the silver powder on the screen printability (i.e. rheology, thixotropy, etc) and sintering of silver conductor paste have been investigated in this study. The variation in the rheology and sintering microstructure has been found to depend upon the type of surfactant treatment of the powders and their particle size. The paste prepared from silver powder treated with triethanolamine and caprylic acid exhibited a pseudoplastic flow and also demonstrated good screenability and better densification in both dried films as well as fired films as compared to those not treated with surfactants. The prepared powders consist of either separated particles or loose agglomerates, which get wetted and dispersed by the organic vehicle, forming a suspension displaying pseudoplastic behaviour. The powders with nanoscale size (100-200 nm) can be considered appropriate for effective thick film applications. Microstructure evolution after firing at 850 ℃ has been studied by examining the morphology and sheet resistance of the thick films.
机译:厚膜糊剂具有非常高的粘度,可以将颗粒保留在悬浮液中。在这项研究中,研究了表面活性剂处理和银粉的粒径对丝网印刷性(即流变学,触变性等)和银导体浆料烧结的影响。已经发现流变学和烧结微结构的变化取决于粉末的表面活性剂处理的类型及其粒度。由三乙醇胺和辛酸处理过的银粉制成的糊剂表现出假塑性流动,并且与未用表面活性剂处理的干粉和焙烧膜相比,在干膜和烧成膜中均表现出良好的筛选性和更好的致密性。所制备的粉末由分离的颗粒或疏松的附聚物组成,它们被有机载体润湿并分散,形成具有假塑性行为的悬浮液。可以认为具有纳米级尺寸(100-200 nm)的粉末适用于有效的厚膜应用。通过检查厚膜的形貌和薄层电阻,研究了在850℃烧成后的微观组织演变。

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