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Study on the growth, etch morphology and spectra of Y_2SiO_5 crystal

机译:Y_2SiO_5晶体的生长,刻蚀形态和光谱研究

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Undoped Y_2SiO_5 single crystal was grown by the Czochralski method. The samples were optically polished after orienting and cutting. The rhombus and quadrangular dislocation etching pits, the low-angle grain boundaries and the inclusions in the samples were observed using optical microscope and scanning electron microscope. The absorption spectra were measured before and after H_2 annealing or air annealing. The absorption edge of Y_2SiO_5 crystal was determined to be about 202 nm. The absorption coefficient of Y_2SiO_5 crystal decreased after H_2 annealing and obviously increased after air annealing.
机译:通过Czochralski法生长未掺杂的Y_2SiO_5单晶。定向和切割后,对样品进行光学抛光。用光学显微镜和扫描电子显微镜观察样品中的菱形和四边形位错刻蚀坑,低角度晶界和夹杂物。在H_2退火或空气退火之前和之后测量吸收光谱。确定Y_2SiO_5晶体的吸收边缘为约202nm。 H_2退火后,Y_2SiO_5晶体的吸收系数下降,空气退火后,Y_2SiO_5晶体的吸收系数明显上升。

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