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Influence of water-cement ratio on the properties of 2-2 cement based piezoelectric composite

机译:水灰比对2-2水泥基压电复合材料性能的影响

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Composites with 2-2 connectivity were fabricated from plates of "PMN" ceramic embedded in a sulphoaluminate cement matrix by a cut-filling process. The influences of the water-cement ratio in the matrix on the properties of the composite were analyzed. The results show that when the water-cement ratio is less than 0.4, the piezoelectric stain factor d_(33) and piezoelectric voltage factor g_(33) increase smoothly. When the water-cement ratio is larger than 0.4, d_(33) and g_(33) increase obviously with increasing the water-cement ratio. This is attributed to a more effective contact between the active and matrix phases. d_(33) = 322 pc N~(-1) and g_(33) = 20.9 mV mN~(-1) at a water-cement ratio of 0.45. The planar electromechanical coupling coefficient K_p of the composite is nearly independent of the water-cement ratio. With increasing the water-cement ratio, the thickness electromechanical coupling coefficient K_1 of the composite increases, while the mechanical quality factor Q_m exhibits the trend of decrease.
机译:具有2-2连接性的复合材料是通过切割填充工艺由嵌入在硫铝酸盐水泥基体中的“ PMN”陶瓷板制成的。分析了基体中水灰比对复合材料性能的影响。结果表明,当水灰比小于0.4时,压电污染因子d_(33)和压电电压因子g_(33)平稳增加。当水灰比大于0.4时,d_(33)和g_(33)随着水灰比的增加而明显增加。这归因于活性相和基质相之间更有效的接触。在水灰比为0.45的情况下,d_(33)= 322 pc N〜(-1)和g_(33)= 20.9 mV mN〜(-1)。复合材料的平面机电耦合系数K_p几乎与水灰比无关。随着水灰比的增加,复合材料的厚度机电耦合系数K_1增大,而机械品质因数Q_m呈现下降的趋势。

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