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Concerning the brittleness of iridium: An elastic and electronic view

机译:关于铱的脆性:弹性和电子观点

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The brittleness of Ir has become a challenging and puzzling problem for decades and its fundamental mechanisms are controversial with each other in the literature. The present first principles calculation aims to get a deep understanding of the brittleness of Ir from an elastic and electronic view. It is found that Ir has normal pressure-dependent mechanical behavior, while the temperature-dependent behavior of Ir is unusual and contrary to that of other FCC metals, and that pressure decreases the brittleness of Ir, whereas temperature increases its brittleness, suggesting that the machining of Ir products should be performed at low temperature and high pressure. Moreover, electronic structure and crystal field theory reveal that Ir has the mainly octahedral bonding, which would be transformed to the mainly cubic bonding under high pressure, while become more octahedral and directional at high temperature. In addition, the implication and importance of the similarities between Ir and semiconductors are also discussed.
机译:几十年来,Ir的脆性已成为一个充满挑战和困惑的问题,其基本机理在文献中相互争议。当前的第一原理计算旨在从弹性和电子角度深入了解Ir的脆性。发现Ir具有正常的压力依赖性机械行为,而Ir的温度依赖性行为是不寻常的并且与其他FCC金属相反,并且压力降低了Ir的脆性,而温度增加了其脆性,表明Ir产品的机加工应在低温和高压下进行。此外,电子结构和晶体场论表明,Ir具有主要的八面体键,在高压下会转变为主要的立方键,而在高温下会变成更多的八面体和定向。此外,还讨论了Ir与半导体之间相似性的含义和重要性。

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