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机译:硅片软砂轮磨削性能的研究
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, China, 116024;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, China, 116024;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, China, 116024;
Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian, China, 116024;
silicon wafer; grinding; soft abrasive wheel; subsurface damage;
机译:硅片用软质砂轮的设计与评估
机译:使用软质砂轮(sagw)对硅片进行化学机械研磨(cmg)的材料去除机理
机译:树脂键合金刚石片对硅片进行平面固定磨削的实验研究
机译:硅晶片软砂轮研磨性能研究
机译:社交网络对硅谷软件行业(加利福尼亚)的性能影响的探索性研究。
机译:骨科或脊柱外科手术后与标准伤口敷料相比评估覆盖有柔软硅酮层的柔性自粘吸收性敷料性能的临床试验:一项随机对照试验的研究方案
机译:利用软磨料砂轮(saGW)去除si晶片化学机械研磨(CmG)的材料去除机理
机译:scepter的性能研究< sup> Tm< / sup>金属结合剂金刚石砂轮