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首页> 外文期刊>JSME International Journal. Series C, Mechanical Systems, Machine Elements and Manufacturing >Experimental Quantization of Surface and Sub-Surface Structure in Float Polished Crystalline Quartz
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Experimental Quantization of Surface and Sub-Surface Structure in Float Polished Crystalline Quartz

机译:浮法抛光石英表面和亚表面结构的实验量化

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摘要

Float polishing {produces extremely flat (<λ/20) surfaces to atomic conformity over large areas. This process was applied to develop robust AT-cut, premium-Q, cultured, crystalline-quartz acoustic oscillators, which are normally highly susceptible to fracture from mechanical shock. The fabrication process was optimized to eliminate sub-surface damage, and to maximize the flexural strength of the crystals. We report premium results of a near-bulk value of stress-fracture threshold of 620 MPa, and a surface roughness of less than 0.2 nm rms for 6.35 mm diameter, 103.8 μm thick samples float polished with colloidal silica. The remarkable surface quality produced by float polishing is combined with a 10-fold improvement in strength over blanks manufactured by the conventional CeO{sub}2 process. We also report on the characterization of the surfaces by atomic force microscopy, scatterometry, and photo acoustic spectroscopy where we see that deep 100 μm removal eliminates damage from processing prior to the final float polish. These results are a significant improvement over the performance of commercially available resonators in equivalent tests.
机译:浮法抛光{可在大面积上产生非常平坦的表面(<λ/ 20)以达到原子一致性。此过程用于开发坚固耐用的AT切割,优质Q,培养的晶体石英声振荡器,该振荡器通常极易受到机械冲击的破坏。优化了制造工艺,以消除表面下的损坏,并使晶体的弯曲强度最大化。我们报告了优质的结果:应力-断裂阈值的近似值是620 MPa,对于直径为6.35毫米,厚度为103.8μm的样品用胶体二氧化硅进行浮抛,其表面粗糙度小于0.2 nm rms。与传统的CeO {sub} 2工艺制造的毛坯相比,浮法抛光产生的卓越表面质量与强度提高了10倍。我们还报告了通过原子力显微镜,散射法和光声光谱学对表面进行表征的过程,其中我们看到深100μm的去除消除了最终浮法抛光之前的加工损伤。这些结果是在等效测试中对商用谐振器性能的重大改进。

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