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首页> 外文期刊>日本機械学会論文集. A編 >A Study on Fatigue Crack Propagation Behavior of Silicon Nitride Ceramics Using a Fracture Mechanics Fatigue Test
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A Study on Fatigue Crack Propagation Behavior of Silicon Nitride Ceramics Using a Fracture Mechanics Fatigue Test

机译:用断裂力学疲劳试验研究氮化硅陶瓷的疲劳裂纹扩展行为

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摘要

Fatigue crack propagation tests of silicon nitride were conducted under constant K_max and constant stress ratio R using double eccentric pulsating compressive loading at room temperature. The crack propagation rate da/dN could be expressed as a function of K(~a)_max·ΔK~(1-a). However, scatter due to bridging friction was observed in the diagram of da/dN versus K(~a)_max·ΔK~(1-a). The plotting of da/dN against ΔK_eff reduced the influence of bridging friction on the expression of crack propagation. Also, the plotting revealed that the crack propagtion under high K_max is caused by static fatigue and the propagation under lower K_max is by pure fatigue. From these observation, it is suggested that ΔK_eff defined as the range of stress intensity factor during crack opening is close to the range of stress intensity factor at crack tip K_tip.
机译:在室温下使用双偏心脉动压缩载荷,在常数K_max和常数应力比R下进行氮化硅的疲劳裂纹扩展测试。裂纹扩展速率da / dN可以表示为K(〜a)_max·ΔK〜(1-a)的函数。然而,在da / dN与K(〜a)_max·ΔK〜(1-a)的关系图中,观察到了由桥联摩擦引起的分散。 da / dN对ΔK_eff的绘图减少了桥接摩擦对裂纹扩展表达的影响。此外,该图还表明,高K_max下的裂纹扩展是由静态疲劳引起的,而低K_max下的裂纹扩展是由纯疲劳引起的。从这些观察结果可以看出,定义为裂纹开放期间的应力强度因子的范围的ΔK_eff接近于裂纹尖端K_tip的应力强度因子的范围。

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