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首页> 外文期刊>Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures >Characterization of enhancement-mode n-channel sulfur-treated InP MOSFET with liquid phase deposition-TiO2 gate oxide
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Characterization of enhancement-mode n-channel sulfur-treated InP MOSFET with liquid phase deposition-TiO2 gate oxide

机译:液相沉积-TiO2栅氧化物表征增强型n沟道硫处理的InP MOSFET

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摘要

TiO2 films were prepared with aqueous solutions of hexafluorotitanic acid and boric acid on an InP substrate with an ammonium sulfide treatment. The films showed greatly enhanced electrical characteristics compared to those prepared without the ammonium sulfide treatment. The leakage currents of the resulting TiO2/InP capacitor reached 2.1 × 10-7 and 7.4 × 10-7 A/cm2 at ±0.5 MV/cm. The dielectric constant and the effective oxide charges were 43 and -2 × 1011 C/cm2, respectively. The interface state density was 3.6 × 1011 cm-2 eV-1. The fabricated enhancement-mode n-channel InP MOSFET exhibited good electrical characteristics with a maximum gm of 43 mS/mm and electron mobility of 348 cm2/Vs.
机译:用六氟钛酸和硼酸的水溶液在硫化铵处理的InP基片上制备TiO2薄膜。与未使用硫化铵处理的薄膜相比,该薄膜显示出大大增强的电气特性。所得TiO2 / InP电容器的泄漏电流在±0.5时达到2.1×10 -7 和7.4×10 -7 A / cm 2 MV /厘米。介电常数和有效氧化物电荷分别为43和-2×10 11 C / cm 2 。界面态密度为3.6×10 11 cm -2 eV -1 。制作的增强型n沟道InP MOSFET具有良好的电学特性,最大gm为43 mS / mm,电子迁移率为348 cm 2 / Vs。

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