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首页> 外文期刊>Journal of University of Science and Technology Beijing >Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed Al-Si and Al-Si-SiC powders
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Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed Al-Si and Al-Si-SiC powders

机译:Al-Si和Al-Si-SiC混合粉末的插入层对SiCp / Al复合材料的反应扩散键合

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摘要

Mixed Al-Si and Al-Si-SiC powders were employed as insert layers to reactive diffusion bond SiCp/6063 MMC (metal matrix composites). The results show that SiCp/6063 MMC joints bonded by the insert layer of the mixed Al-Si powder have a dense joining layer with a typical hypoeutectic microstructure. Using the mixed Al-Si-SiC powder as the insert layer, SiCp/6063 MMC can be reactive diffusion bonded by a composite joint. Because of the SiC segregation, however, there are a number of porous zones in the joining layer, which results in the bad shear strength of the joints reactive diffusion bonded by the insert layer of the mixed Al-Si-SiC powder, even lower than that of the joints reactive diffusion bonded by the insert layer of the mixed Al-Si powder. Ti and Mg added in the insert layers obviously improve the strength of the joints reactive diffusion bonded by the insert layer of the mixed Al-Si-SiC powder, especially, Mg has a more obvious effect.
机译:采用混合的Al-Si和Al-Si-SiC粉末作为插入层,以反应扩散键结合SiCp / 6063 MMC(金属基复合材料)。结果表明,通过混合Al-Si粉末的插入层粘结的SiCp / 6063 MMC接头具有致密的连接层,具有典型的亚共晶组织。使用混合的Al-Si-SiC粉末作为插入层,可以通过复合接头对SiCp / 6063 MMC进行反应性扩散结合。然而,由于SiC的偏析,在连接层中存在许多多孔区域,这导致由混合Al-Si-SiC粉末的插入层粘结的接头反应性扩散的剪切强度差,甚至低于混合的Al-Si粉末的插入层所结合的接头的反应性扩散的应力。插入层中添加的Ti和Mg明显提高了混合Al-Si-SiC粉末的插入层通过结合扩散反应产生的接头的强度,特别是Mg具有更明显的作用。

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