A sub-interface thermal crack problem for bonded dissimilar plates with interfacial thermal resistance

摘要

The present work aims to investigate the effect of interfacial thermal resistance on thermal fracture behavior of bonded and composite materials. We consider a sub-interface crack parallel to the interface between two semi-infinite dissimilar plates subjected to remote heat flux thermal loading. A constant thermal resistance is assumed to exist along the interface. The temperature distribution along the crack, the thermal stress intensity factors (TSIFs), and the crack opening/sliding displacements (COD/CSD) are obtained using an integral transform/superposition method. The numerical results for Al2O3/Si3N4 bimaterial systems show that the magnitude of the mode I TSIF generally decreases with increasing thermal resistance of the interface but increases with increasing thermal resistance for cracks that are very close to the interface. On the other hand, the model II TSIF increases with increasing thermal resistance if the crack is in the Al2O3 semi-infinite plate, and decreases if the crack is in the Si3N4 semi-infinite plate. The COD/CSD are also significantly influenced by the thermal resistance of the interface.