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Quadruple H-Bonding Cross-Linked Supramolecular Polymeric Materials as Substrates for Stretchable, Antitearing, and Self- Healable Thin Film Electrodes

机译:四重H键交联超分子聚合物材料作为可拉伸,抗撕裂和自修复薄膜电极的基材

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摘要

Herein, we report a de novo chemical design of supramolecular polymer materials (SPMs-1 –3 ) by condensation polymerization, consisting of (i) soft polymeric chains (polytetramethylene glycol and tetraethylene glycol) and (ii) strong and reversible quadruple H-bonding cross-linkers (from 0 to 30 mol %). The former contributes to the formation of the soft domain of the SPMs, and the latter furnishes the SPMs with desirable mechanical properties, thereby producing soft, stretchable, yet tough elastomers. The resulting SPM-2 was observed to be highly stretchable (up to 17 000% strain), tough (fracture energy ∼30 000 J/m~(2)), and self-healing, which are highly desirable properties and are superior to previously reported elastomers and tough hydrogels. Furthermore, a gold, thin film electrode deposited on this SPM substrate retains its conductivity and combines high stretchability (∼400%), fractureotch insensitivity, self-healing, and good interfacial adhesion with the gold film. Again, these properties are all highly complementary to commonly used polydimethylsiloxane-based thin film metal electrodes. Last, we proceed to demonstrate the practical utility of our fabricated electrode via both in vivo and in vitro measurements of electromyography signals. This fundamental understanding obtained from the investigation of these SPMs will facilitate the progress of intelligent soft materials and flexible electronics.
机译:本文中,我们报告了通过缩聚反应从头开始的超分子聚合物材料(SPMs-b-1 -b3)的化学设计,该结构由(i)软聚合物链(聚丁二醇和四甘醇)和(ii)和可逆的四重H键交联剂(0至30 mol%)。前者有助于形成SPM的软区域,而后者则为SPM提供所需的机械性能,从而生产出柔软,可拉伸但坚韧的弹性体。观察到所得的SPM-b 2具有高度可拉伸性(高达17 000%应变),坚韧(断裂能〜30 000 J / m〜(2))和自修复性,是非常理想的性能和优于先前报道的弹性体和坚韧的水凝胶。此外,沉积在该SPM基板上的金薄膜电极保留了其导电性,并具有高拉伸性(〜400%),断裂/缺口不敏感性,自修复以及与金膜的良好界面粘合性。同样,这些性质都与常用的基于聚二甲基硅氧烷的薄膜金属电极高度互补。最后,我们通过肌电信号的体内和体外测量来证明我们制造的电极的实用性。通过对这些SPM的调查获得的基本理解将有助于智能软材料和柔性电子学的发展。

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  • 来源
    《Journal of the American Chemical Society》 |2018年第15期|5280-5289|共10页
  • 作者单位

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States,Department of Polymer Science and Engineering, School of Chemistry and Chemical Engineering, Nanjing University, Nanjing 210093, People’s Republic of China;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China,Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen 518055, People’s Republic of China;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China,Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen 518055, People’s Republic of China;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China;

    CAS Key Lab of Human-Machine Intelligence-Synergy Systems, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences (CAS), Shenzhen 518055, People’s Republic of China;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

    Innovative Center for Flexible Devices, School of Materials Science and Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798, Singapore;

    Department of Chemical Engineering, Stanford University, Stanford, California 94305, United States;

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