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首页> 外文期刊>Journal of Materials Science >Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au–Ni–V filler alloy
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Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au–Ni–V filler alloy

机译:Au–Ni–V钎料钎焊Si 3 N 4 / Si 3 N 4 接头的界面微观结构

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摘要

By using Au58.74Ni36.50V4.76 at.% filler alloy, a reliable Si3N4/Si3N4 joint was brazed at 1,423 K for 60 min in vacuum. The microstructure of the joint was investigated and analyzed by scanning electron microscope with energy dispersive spectroscopy, transmission electron microscopy, and X-ray diffraction. The results indicate that the joint consists of three main phases: a continuous VN reaction layer between filler alloy and Si3N4 ceramic; an Au[Ni] solid solution as the matrix of the joint; and Ni[Si,V] solid solution particles distributed homogeneously in the Au[Ni] solid solution. The mechanism of formation of the interfacial structure is discussed.
机译:通过使用Au58.74Ni36.50V4.76 at。%填充合金,可得到可靠的Si 3 N 4 / Si 3 N 4 接头在真空中以1,423 K钎焊60分钟。通过扫描电子显微镜,能量色散谱,透射电子显微镜和X射线衍射研究和分析了接头的微观结构。结果表明,该接头由三个主要相组成:填充合金和Si 3 N 4 陶瓷之间的连续VN反应层。 Au [Ni]固溶体作为接头的基体; Ni [Si,V]固溶体颗粒均匀地分布在Au [Ni]固溶体中。讨论了界面结构的形成机理。

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