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机译:0.7Pb(Zr_(0.46)Ti_(0.54))O_3-0.1Pb(Zn_(1/3)Nb_(2/3))O_3-0.2Pb(Ni_(1/3)Nb_的自支撑多层厚膜(2/3))O_3,共烧温度低
机译:大应变0.7Pb(Zr_xTi_(1-x))O_3-0.1Pb(Zn_(1/3)Nb_(2/3))O_3-0.2Pb(Ni_(1/3)Nb_(2/3))O_3高温应用的压电陶瓷
机译:低温烧结Pb(Mn_(1/3)Nb_(2/3))O_3-Pb(Zn_(1/3)Nb_(2/3))O_3-Pb(Zr_(0.48)Ti_( 0.52))O_3陶瓷,用于低损耗多层压电执行器
机译:高能密度0.72Pb(Zr_(0.47)Ti_(0.53))O_3-0.28Pb [(Zn_(0.45)Ni_(0.55 _)_(1/3)Nb_(2/3)] O_3胶带制造的厚膜能量收集设备应用的铸造
机译:XPB的介电和压电性能(Ni_(1/3)NB_(2/3))O_3-YPB(MN_(1/3)NB_(1/3)SB_(1/3))O_3-(1-XY) PB(Zr_(0.48)TI_(0.52))O_3陶瓷
机译:薄膜弛豫铁电体中的巨电热效应0.9 pbmg_(1/3)Nb_(2/3)O_3 - 0.1 pbTiO_3接近室温
机译:利用au-pt-pd厚膜导体在低温共烧陶瓷(LTCC)基板上分析细间距,倒装芯片焊料互连的拉伸强度行为