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Polymer-Based MEMS Photodetector With Spectral Response in UV-Vis-NIR and Mid-IR Region

机译:在紫外可见近红外和中红外区域具有光谱响应的基于聚合物的MEMS光电探测器

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摘要

Integrating various components on the same chip is highly sought after for various optoelectronic applications. In an attempt to provide an on-chip photodetection, a MEMS-based photodetector device with a wide spectral response is presented. The design merges the photoconductive and pyroelectric properties of nanomorphology-controlled polyvinyl alcohol as a photoactive layer. The fabrication technology is low cost with a single-layer deposition of photoactive polymer on a MEMS low thermal mass platform designed to improve the heat loss to the substrate. This fabricated device with a metal–semiconductor–metal structure shows Schottky diode behavior. The photoresponse of this device was observed from UV to mid-IR region with minimum light detection capability of 30 nW in UV, 120 nW for visible light, and 100 μW for IR light. The effect of nanomorphology and the thickness of the photoactive layer were studied to optimize the responsivity in the different waveband regions. Typically, at zero bias, under 405-nm illumination with light intensity of 170 μW/cm, the photodetector exhibited responsivity of 0.53 A/W. The wavelength response of this detector was found to be similar with standard detectors of the UV visible as well as mid-IR region (6.3–10.6 μm). The proposed on-chip MEMS-based photodetection module with the broad-spectrum detection capability and lower power consumption is useful for lab-on-chip-based technologies for a wide range of optical/spectroscopic applications.
机译:对于各种光电应用,强烈要求在同一芯片上集成各种组件。为了提供片上光电检测,提出了具有宽光谱响应的基于MEMS的光电检测器装置。该设计将纳米形态学控制的聚乙烯醇的光电导和热电性质合并为光敏层。通过在MEMS低热质量平台上单层沉积光活性聚合物来降低制造工艺的成本,该平台旨在改善基板的热损失。这种具有金属-半导体-金属结构的制造器件显示出肖特基二极管的行为。从紫外线到中红外区域观察到该设备的光响应,其最小光检测能力在紫外线下为30 nW,对于可见光为120 nW,对于红外光为100μW。研究了纳米形态和光敏层厚度的影响,以优化不同波段区域的响应度。通常,在零偏压下,在405 nm的光照下,光强度为170μW/ cm的情况下,光电探测器的响应度为0.53 A / W。发现该检测器的波长响应与可见光和中红外区域(6.3-10.6μm)的标准检测器相似。所提出的基于芯片的基于MEMS的光电检测模块具有广谱检测能力和较低的功耗,可用于基于芯片实验室的技术,适用于各种光学/光谱应用。

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