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Connecting Silicon Photonic Circuits to Multicore Fibers by Photonic Wire Bonding

机译:通过光子引线键合将硅光子电路连接到多芯光纤

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摘要

Photonic wire bonding is demonstrated to enable highly efficient coupling between multicore fibers and planar silicon photonic circuits. The technique relies on in-situ fabrication of three-dimensional interconnect waveguides between the fiber facet and tapered silicon-on-insulator waveguides. Photonic wire bonding can easily compensate inaccuracies of core placement in the fiber cross-section, does not require active alignment, and is well suited for automated fabrication. We report on the design, on fabrication, and on characterization of photonic wire bonds. In a proof-of-principle experiment, a four-core fiber is coupled to a silicon photonic chip, leading to measured coupling losses as small as 1.7 dB.
机译:证明了光子引线键合能够实现多芯光纤和平面硅光子电路之间的高效耦合。该技术依赖于在光纤刻面和锥形绝缘体上硅波导之间的三维互连波导的原位制造。光子引线键合可以轻松补偿光纤横截面中纤芯放置的不精确性,不需要主动对准,非常适合自动化制造。我们报告有关光子丝键合的设计,制造和表征的信息。在原理验证实验中,将四芯光纤耦合到硅光子芯片,从而导致测得的耦合损耗小至1.7 dB。

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