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Thermoelectric Performance of Novel Composite and Integrated Devices Applied to Waste Heat Recovery

机译:用于废热回收的新型复合材料和集成设备的热电性能

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摘要

Thermoelectric elements, made of semiconductor slices laminated onto highly conductive interconnector materials, are termed composite thermoelectric device (TED). An integrated TED is a composite TED with the interconnector designed as an internal heat exchanger with flow channels directing the working fluid between the source and element legs. In this work, novel composite and integrated TEDs are proposed as an alternative to conventional TEDs, and their performance in terms of power output P_o, heat input Q_h, conversion efficiency η, and the produced electrical current I is studied using analytical solutions. The top and bottom surfaces of the TED are subjected to a temperature differential while the side surfaces are exposed to either ambient or adiabatic conditions. An increment in temperature differential results in enhanced device performance. For a fixed temperature differential, the integrated TED shows nearly an eight-fold increase in both P_o and Q_h and a four-fold increase in I, whereas the composite TED shows approximately a two-fold increase in P_o, Q_h, and I when compared to the conventional TED values. Both novel TED designs have a minimal impact on efficiency predictions. However, an increase in semiconductor slice thickness resulted in an exponential decrease in P_o, Q_h, and I, and an exponential increase in η values and reaches a limit of conventional TED values. The effect of semiconductor slice thickness on η in the novel TEDs is remarkable when it is less than I mm. The change in ambient conditions via convective heat transfer coefficient has negligible effects on P_o; however, a substantial change in n occurs when it is less than 100 Wm~(-2)K~(-1).
机译:由层压在高导电互连材料上的半导体切片制成的热电元件称为复合热电器件(TED)。集成TED是复合TED,其互连器设计为内部热交换器,并具有在源支腿和元件支腿之间引导工作流体的流道。在这项工作中,提出了新颖的复合和集成TED作为传统TED的替代方案,并使用解析解研究了它们在功率输出P_o,热量输入Q_h,转换效率η和产生的电流I方面的性能。 TED的顶面和底面经受温差,而侧面则暴露于环境或绝热条件下。温差的增加导致器件性能增强。对于固定的温度差,积分TED的P_o和Q_h均增加近8倍,I则增加4倍,而复合TED的P_o,Q_h和I则增加约2倍。达到传统的TED值。两种新颖的TED设计对效率预测的影响都很小。但是,半导体切片厚度的增加导致P_o,Q_h和I呈指数下降,η值呈指数增长,并达到常规TED值的极限。当新型TEDs的半导体切片厚度小于1 mm时,其厚度对η的影响非常明显。通过对流换热系数改变环境条件对P_o的影响可忽略不计;然而,当n小于100 Wm〜(-2)K〜(-1)时,n会发生较大变化。

著录项

  • 来源
    《Journal of Heat Transfer》 |2013年第3期|031706.1-031706.11|共11页
  • 作者单位

    Department of Mechanical Engineering and Materials Science, University of Pittsburgh,Pittsburgh, PA 15261;

    Department of Mechanical Engineering and Materials Science, University of Pittsburgh,Pittsburgh, PA 15261;

    Department of Mechanical Engineering and Materials Science, University of Pittsburgh,Pittsburgh, PA 15261;

    Department of Mechanical Engineering and Materials Science, University of Pittsburgh,Pittsburgh, PA 15261;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    thermoelectrics; composite; integrated; conventional; analytical model; waste heat recovery; performance;

    机译:热电;综合;集成;常规;分析模型余热回收;性能;

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