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A Fast Hybrid Fourier-Boltzmann Transport Equation Solver for Nongray Phonon Transport

机译:Nongray声子传输的快速混合Fourier-Boltzmann传输方程求解器

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Nongray phonon transport solvers based on the Boltzmann transport equation (BTE) are being increasingly employed to simulate submicron thermal transport in semiconductors and dielectrics. Typical sequential solution schemes encounter numerical difficulties because of the large spread in scattering rates. For frequency bands with very low Knud-sen numbers, strong coupling between other BTE bands result in slow convergence of sequential solution procedures. This is due to the explicit treatment of the scattering kernel. In this paper, we present a hybrid BTE-Fourier model which addresses this issue. By establishing a phonon group cutoff Kn_c, phonon bands with low Knudsen numbers are solved using a modified Fourier equation which includes a scattering term as well as corrections to account for boundary temperature slip. Phonon bands with high Knudsen numbers are solved using the BTE. A low-memory iterative solution procedure employing a block-coupled solution of the modified Fourier equations and a sequential solution of BTEs is developed. The hybrid solver is shown to produce solutions well within 1% of an all-BTE solver (using Kn_c = 0.1), but with far less computational effort. Speedup factors between 2 and 200 are obtained for a range of steady-state heat transfer problems. The hybrid solver enables efficient and accurate simulation of thermal transport in semiconductors and dielectrics across the range of length scales from submicron to the macro-scale.
机译:基于玻尔兹曼输运方程(BTE)的Nongray声子输运求解器正越来越多地用于模拟半导体和电介质中的亚微米热输运。由于散射率的大范围扩展,典型的顺序求解方案遇到了数值难题。对于Knud-sen数非常低的频段,其他BTE频段之间的强耦合会导致顺序求解过程的收敛缓慢。这是由于对散射核的显式处理。在本文中,我们提出了解决此问题的混合BTE-Fourier模型。通过建立声子群截止值Kn_c,可以使用修正的Fourier方程来求解具有低Knudsen数的声子带,该方程包括散射项以及考虑边界温度滑移的修正。使用BTE解决了具有高克努森数的声子带。开发了一种低内存迭代求解程序,该程序采用了经过修改的傅里叶方程的块耦合解和BTE的顺序解。证明混合求解器产生的解决方案的精度在全BTE求解器的1%以内(使用Kn_c = 0.1),但计算量却少得多。对于一系列稳态传热问题,可以获得2到200之间的加速因子。混合求解器能够在从亚微米到宏观尺度的整个长度尺度范围内,对半导体和电介质中的热传输进行高效,准确的仿真。

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