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Multi-objective Design Optimization of Branching,Multifloor, Counterflow Microheat Exchangers

机译:分支,多层,逆流微热交换器的多目标设计优化

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Heat removal capacity, coolant pumping power requirement, and surface temperature nonuniformity are three major challenges facing single-phase flow microchannel compact heat exchangers. In this paper multi-objective optimization has been performed to increase heat removal capacity, and decrease pumping power and temperature nonuniformity in complex networks of microchannels. Three-dimensional (3D) four-floor configurations of counterflow branching networks of microchannels were optimized to increase heat removal capacity from surrounding silicon substrate (15 × 15 ×2 mm). Each floor has four different branching subnetworks with opposite flow direction with respect to the next one. Each branching subnetwork has four inlets and one outlet. Branching patterns of each of these subnetworks could be different from the others. QuasiSD conjugate heat transfer analysis has been performed by developing a software package which uses quasi-1D thermofluid analysis and a 3D steady heat conduction analysis. These two solvers were coupled through their common boundaries representing surfaces of the cooling microchannels. Using quasi-3D conjugate analysis was found to require one order of magnitude less computing time than a fully 3D conjugate heat transfer analysis while offering comparable accuracy for these types of application. The analysis package is capable of generating 3D branching networks with random topologies. Multi-objective optimization using modeFRONTIER software was performed using response surface approximation and genetic algorithm. Diameters and branching pattern of each subnetwork and coolant flow direction on each floor were design variables of multi-objective optimization. Maximizing heat removal capacity, while minimizing coolant pumping power requirement and temperature nonuniformity on the hot surface, were three simultaneous objectives of the optimization. Pareto-optimal solutions demonstrate that thermal loads of up to 500 Wlcm~2 can be managed with four-floor microchannel cooling networks. A fully 3D thermofluid analysis was performed for one of the optimal designs to confirm the accuracy of results obtained by the quasi-3D simulation package used in this paper.
机译:散热能力,冷却剂泵送功率要求和表面温度不均匀性是单相流微通道紧凑型换热器面临的三个主要挑战。在本文中,已经进行了多目标优化,以增加散热能力,并减少复杂微通道网络中的泵送功率和温度不均匀性。优化了微通道的逆流分支网络的三维(3D)四层配置,以提高从周围硅基板(15×15×2 mm)的散热能力。每层都有四个不同的分支子网,相对于下一分支,它们的流向相反。每个分支子网具有四个入口和一个出口。这些子网中每个子网的分支模式都可能彼此不同。通过开发使用准1D热流体分析和3D稳态热传导分析的软件包,可以执行QuasiSD共轭传热分析。这两个求解器通过它们代表冷却微通道表面的公共边界耦合。发现使用准3D共轭分析比完全3D共轭传热分析所需的计算时间少一个数量级,同时为这些类型的应用提供可比的精度。该分析软件包能够生成具有随机拓扑的3D分支网络。使用modeFRONTIER软件使用响应面近似和遗传算法进行了多目标优化。每个子网的直径和分支模式以及每个楼层上的冷却剂流动方向是多目标优化的设计变量。优化的三个同时目标是,最大程度地提高排热能力,同时最大程度地减少冷却剂泵送功率需求和热表面温度不均匀性。帕累托最优解决方案表明,使用四层微通道冷却网络可以管理高达500 Wlcm〜2的热负荷。对一种最佳设计进行了全3D热流体分析,以确认通过本文中使用的准3D仿真程序包获得的结果的准确性。

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