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首页> 外文期刊>Journal of Electronic Materials >Progress in the Molecular Beam Epitaxy of HgCdTe on Large-Area Si and CdZnTe Substrates
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Progress in the Molecular Beam Epitaxy of HgCdTe on Large-Area Si and CdZnTe Substrates

机译:HgCdTe在大面积Si和CdZnTe衬底上的分子束外延研究进展

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This paper presents the progress in the molecular beam epitaxy (MBE) growth of HgCdTe on large-area Si and CdZnTe substrates at Raytheon Vision Systems. We report a very high-quality HgCdTe growth, for the first time, on an 8 cm × 8 cm CdZnTe substrate. This paper also describes the excellent HgCdTe growth repeatability on multiple 7 cm × 7 cm CdZnTe substrates. In order to study the percentage wafer area yield and its consistency from run to run, small lots of dual-band long-wave infrared/long-wave infrared triple-layer heterojunction (TLHJ) layers on 5 cm × 5 cm CdZnTe substrates and single-color double-layer heterojunction (DLHJ) layers on 6-inch Si substrates were grown and tested for cutoff wavelength uniformity and micro- and macrovoid defect density and uniformity. The results show that the entire lot of 12 DLHJ-HgCdTe layers on 6-inch Si wafers meet the testing criterion of cutoff wavelength within the range 4.76 ± 0.1 μm at 130 K and micro- and macrovoid defect density of ≤50 cm−2 and 5 cm−2, respectively. Likewise, five out of six dual-band TLHJ-HgCdTe layers on 5 cm × 5 cm CdZnTe substrates meet the testing criterion of cutoff wavelength within the range 6.3 ± 0.1 μm at 300 K and micro- and macrovoid defect density of ≤2000 cm−2 and 500 cm−2, respectively, on the entire wafer area. Overall we have found that scaling our HgCdTe MBE process to a 10-inch MBE system has provided significant benefits in terms of both wafer uniformity and quality.
机译:本文介绍了雷神视觉系统公司在大面积Si和CdZnTe衬底上HgCdTe分子束外延(MBE)生长的进展。我们首次报道了在8 cm×8 cm CdZnTe衬底上的高质量HgCdTe生长。本文还描述了在多种7 cm×7 cm CdZnTe衬底上出色的HgCdTe生长可重复性。为了研究每次运行时晶片面积百分比的百分比及其一致性,在5 cm×5 cm CdZnTe衬底和单个衬底上制作了小批量的双波段长波红外/长波红外三层异质结(TLHJ)层生长在6英寸Si衬底上的彩色双层异质结(DLHJ)层,并测试截止波长均匀性以及微孔和大孔缺陷密度和均匀性。结果表明,在6英寸Si晶片上的全部12个DLHJ-HgCdTe层均满足在130 K下截止波长在4.76±0.1μm范围内且微孔和大孔缺陷密度≤50cm的测试标准。 −2 和5 cm −2 。同样,在5 cm×5 cm CdZnTe基板上的六个双带TLHJ-HgCdTe层中,有五个满足300 K下截止波长在6.3±0.1μm范围内的微标准和宏观空隙缺陷密度≤2000 cm <在整个晶圆区域上分别为sup> -2 和500 cm -2 。总的来说,我们发现将HgCdTe MBE工艺扩展到10英寸MBE系统可在晶圆均匀性和质量方面带来显着优势。

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