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Homoepitaxial growth and electrical characterization of GaN-based Schottky and light-emitting diodes

机译:GaN基肖特基和发光二极管的同质外延生长和电学表征

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Homoepitaxial growth of GaN epilayers on free-standing hydride vapor phase epitaxy (HVPE) GaN substrates offered a better control over surface morphology, defect density, and doping concentration compared to conventional heteroepitaxial growth. The FWHM of the (0002) X-ray diffraction (XRD) rocking curve from homoepitaxial GaN was measured to be as low as 79 arcsec, much smaller than ~230 arcsec for GaN grown on sapphire. Schottky diodes grown on GaN substrates exhibited sharper breakdown characteristics and much lower reverse leakage than diodes on sapphire. However, the homoepitaxial devices had poor scalability due to the presence of yield-killing defects originating from the substrate surface. Vertical InGaN/GaN light-emitting diodes (LEDs) on GaN substrates showed reduced series resistance and reverse leakage compared to lateral LEDs on sapphire. Wafer mapping demonstrated that the distribution of leaky homoepitaxial devices correlated well with that of macroscopic defects in the GaN substrates.
机译:与传统的异质外延生长相比,在独立的氢化物气相外延(HVPE)上GaN外延层的同质外延生长可以更好地控制表面形态,缺陷密度和掺杂浓度。经测量,同质外延GaN的(0002)X射线衍射(XRD)摇摆曲线的FWHM低至79 arcsec,远小于在蓝宝石上生长的GaN的〜230 arcsec。与在蓝宝石上的二极管相比,在GaN衬底上生长的肖特基二极管具有更清晰的击穿特性和更低的反向泄漏。然而,由于存在源自衬底表面的抑制产量的缺陷,同质外延器件的可扩展性差。与蓝宝石上的横向LED相比,GaN衬底上的垂直InGaN / GaN发光二极管(LED)显示出降低的串联电阻和反向漏电。晶圆制图表明,泄漏的同质外延器件的分布与GaN衬底中的宏观缺陷的分布密切相关。

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