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Lateral trench oxide Schottky rectifier on SOI for power integrated circuits

机译:用于功率集成电路的SOI上的横向沟槽氧化物肖特基整流器

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摘要

In this paper, a Lateral Trench Oxide Schottky (LTOS) rectifier on silicon-on-insulator suitable for power integrated circuits is presented. The proposed structure utilizes a surface Schottky contact with vertical field-plate placed in a trench filled with oxide. The field-plate reduces the electric field on the Schottky contact and suppresses the barrier lowering effect leading to significant improvement in the device performance. Further, the proposed structure folds the drift region in vertical and horizontal directions resulting substantial reduction in pitch length of the device. Two-dimensional numerical simulations have been performed to analyse and optimize the performance of proposed device and results are compared with that of the conventional lateral Schottky rectifier. The LTOS rectifier provides 60 % improvement in breakdown voltage and 50 % reduction in pitch length as compared to the conventional device while maintaining low forward voltage drop and low reverse leakage current.
机译:本文提出了适用于功率集成电路的绝缘体上硅上的横向沟槽氧化肖特基(LTOS)整流器。所提出的结构利用与垂直场板的表面肖特基接触,该垂直场板放置在充满氧化物的沟槽中。场板减小了肖特基触点上的电场,并抑制了势垒降低效应,从而大大改善了器件性能。此外,所提出的结构在垂直和水平方向上折叠漂移区域,从而大大减小了器件的节距长度。进行了二维数值模拟,以分析和优化所提出器件的性能,并将结果与​​常规横向肖特基整流器进行了比较。与传统器件相比,LTOS整流器在击穿电压方面提高了60%,在节距长度上降低了50%,同时保持了低正向压降和低反向泄漏电流。

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