首页> 外文期刊>Journal of Cleaner Production >Gold recovery from secondary waste of PCBs by electro-Cb leaching in brine solution and solvo-chemical separation with tri-butyl phosphate
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Gold recovery from secondary waste of PCBs by electro-Cb leaching in brine solution and solvo-chemical separation with tri-butyl phosphate

机译:通过电氢溶液中的电气Cb浸出从PCB的二次浪费和用三丁基磷酸盐的溶剂化学分离

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In the present study, sustainable recycling of gold from the secondary stream of waste printed circuit boards using brine leaching with electro-Cl-2 and solvo-chemical strategies was investigated. More than 99% of gold was leached in 2.0 mol.L-1 NaCl solution at pH, 1.0; electro-Cl-2 rate, 0.62 mmol min(-1); temperature, 50 degrees C; and time, 75 min. The kinetic data best fitted to the logarithmic model, while activation energy (16.3 kJ mol(-1)) indicated an intermediate-controlled leaching process. Results corroborated with the solution chemistry and reaction thermodynamics of the AueNaCl-(electro)Cl-2 system could reveal the stepwise reaction mechanism. In-situ generated Cl-2(g) first dissolved in a brine solution that forming Cl-2(aq), which subsequently converted to NaClO and diffused on gold particles to liberate the gold-chloro complex. Gold from the brine leach liquor was quantitatively separated using 0.5 mol.L-1 TBP at pH((eq)) = 0.5 and O:A = 1:1. The formation of ([HAuCl4 center dot 2TBP center dot H2O) over bar complex through the ion-pair solvation into the organic phase was supported by advanced spectral analysis. Finally, a highpurity gold with 99% efficiency was stripped by contacting the Au-loaded organic phase with 0.2 mol.L-1 thiosulfate solution; however, using the same concentration of thiourea yielded only a 94% efficacy. This study successfully eliminates the use of highly toxic lixiviants (like aqua-regia and cyanide) in gold metallurgy along with the regeneration and reusable benefits of the organic solvent (TBP). (c) 2021 Elsevier Ltd. All rights reserved.
机译:在本研究中,研究了使用用电镀-CL-2和溶剂化学策略的盐水浸出的盐水浸出的废物印刷电路板二次流动的可持续回收。超过99%的金在2.0mol.1-1 NaCl溶液中在pH,1.0下浸出;电镀-2速率,0.62mmol min(-1);温度50℃;和时间,75分钟。最佳适合对数模型的动力学数据,而激活能量(16.3 kJ mol(-1))表示中间控制的浸出过程。用溶液化学和反应热力学的结果证实了α-(电镀)CL-2系统的结果可以揭示逐步反应机制。原位产生的Cl-2(g)首先溶解在形成Cl-2(水溶液)的盐水溶液中,随后转化为NaClO并扩散在金颗粒上以释放金 - 氯复合物。使用0.5mol.L-1 TBP在pH((等式))= 0.5和O:a = 1:1中定量分离盐水浸出液中的金。通过先进的光谱分析支持通过离子对溶剂的杆复合物的([Haucl4中心点2TBP中心点H2O)的形成是否支持在有机相中。最后,通过用0.2mol.L-1硫代硫酸钠溶液接触Au-Loaded有机相,剥离高料黄金。然而,使用相同的硫脲浓度产生了94%的疗效。本研究成功消除了在金冶金中使用高毒菌毒性(如Aqua-Regia和Cyanide)以及有机溶剂(TBP)的再生和可重复使用的益处。 (c)2021 elestvier有限公司保留所有权利。

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