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首页> 外文期刊>Journal of Applied Physics >Microstructure And Origin Of Dislocation Etch Pits In Gan Epilayers Grown By Metal Organic Chemical Vapor Deposition
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Microstructure And Origin Of Dislocation Etch Pits In Gan Epilayers Grown By Metal Organic Chemical Vapor Deposition

机译:金属有机化学气相沉积法生长的甘外延层中位错蚀坑的微观结构和成因

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Morphology and microstructure of dislocation etch pits in GaN epilayers etched by molten KOH have been investigated by atomic force microscopy, scanning electron microscopy, and transmission electron microscopy (TEM). Three types of etch pits (α, β, and γ) are observed. The α type etch pit shows an inversed trapezoidal shape, the β one has a triangular shape, and the y type one has a combination of triangular and trapezoidal shapes. TEM observation shows that α, β, and y types etch pits originate from screw, edge, and mixed-type threading dislocations (TDs), respectively. For the screw-type TD, it is easily etched along the steps that the dislocation terminates, and consequently, a small Ga-polar plane is formed to prevent further vertical etching. For the edge-type TD, it is easily etched along the dislocation line. Since the mixed-type TDs have both screw and edge components, the y type etch pit has a combination of α and β type shapes. It is also found that the chemical stabilization of Ga-polar surface plays an important role in the formation of various types of dislocation etch pits.
机译:通过原子力显微镜,扫描电子显微镜和透射电子显微镜(TEM)研究了熔融KOH蚀刻的GaN外延层中位错蚀刻坑的形貌和微观结构。观察到三种类型的蚀刻坑(α,β和γ)。 α型刻蚀坑呈倒梯形,β形为三角形,y形为三角形和梯形的组合。 TEM观察表明,α,β和y型蚀刻凹坑分别源自螺钉,边缘和混合型螺纹位错(TD)。对于螺钉型TD,容易沿着位错终止的步骤进行蚀刻,因此,形成小的Ga极面以防止进一步的垂直蚀刻。对于边缘型TD,很容易沿位错线进行蚀刻。由于混合型TD同时具有螺钉和边缘分量,因此y型蚀刻坑具有α和β型形状的组合。还发现Ga极性表面的化学稳定作用在各种类型的位错蚀刻坑的形成中起重要作用。

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