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Effect of Pyrolysis Temperature on the Piezoresistivity of Polymer-Derived Ceramics

机译:热解温度对高分子陶瓷压阻性能的影响

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摘要

Amorphous silicon carbonitride (SiCN) ceramics were synthesized by pyrolyzing a polysilazane at different temperatures between 900° and 1400℃. The microstructures and compositions of the materials obtained were analyzed using X-ray diffraction, elemental analysis, and Raman spectroscopy. To study their piezoresistive behavior, the resistivity of the resultant materials were measured as a function of applied stress. We found that the piezoresistive behavior of all materials can fit the tunneling-per-colation model. The piezoresistive stress coefficient of the materials obtained at temperatures below 1200℃ showed both reverse and logarithmical dependences on applied stress, but that of the materials obtained at higher temperatures showed only logarithmical dependence. We believe that the pyrolysis temperature induces a change in the free carbon structure thus, causing this effect on the piezoresistivity.
机译:通过在900℃至1400℃之间的不同温度下热解聚硅氮烷合成非晶碳氮化硅(SiCN)陶瓷。使用X射线衍射,元素分析和拉曼光谱法分析获得的材料的微观结构和组成。为了研究其压阻行为,测量了所得材料的电阻率与施加应力的关系。我们发现,所有材料的压阻行为都可以拟合逐层隧穿模型。在1200℃以下的温度下得到的材料的压阻应力系数对施加应力表现出反向和对数依赖性,而在较高温度下得到的材料的压阻应力系数仅显示对数依赖性。我们认为热解温度会引起自由碳结构的变化,从而对压阻产生这种影响。

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    National Key Laboratory of Thermostructure Composite Materials, School of Materials Science and Engineering,Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    rnNational Key Laboratory of Thermostructure Composite Materials, School of Materials Science and Engineering,Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    rnNational Key Laboratory of Thermostructure Composite Materials, School of Materials Science and Engineering,Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China;

    rnNational Key Laboratory of Thermostructure Composite Materials, School of Materials Science and Engineering,Northwestern Polytechnical University, Xi'an, Shaanxi 710072, China ,Advanced Materials Processing and Analysis Center, University of Central Florida, Orlando, Florida 32826;

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