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首页> 外文期刊>Japanese journal of applied physics >Novel Stack Structure of Magnetic Tunnel Junction with MgO Tunnel Barrier Prepared by Oxidation Methods: Preferred Grain Growth Promotion Seed Layers and Bi-layered Pinned Layer
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Novel Stack Structure of Magnetic Tunnel Junction with MgO Tunnel Barrier Prepared by Oxidation Methods: Preferred Grain Growth Promotion Seed Layers and Bi-layered Pinned Layer

机译:氧化法制备具有MgO隧道势垒的磁性隧道结的新型堆叠结构:优选的晶粒生长促进种子层和双层固定层

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摘要

Despite superior compatibility to mass-production, magnetic tunnel junction (MTJ) with MgO barrier prepared by oxidation process (MgO_x) has shown unacceptable magnetotransport properties for proper operation of spintronics devices because poor crystalline MgO_x cannot properly provide a template for crystallization of amorphous CoFeB layers, thus lack of pseudo-epitaxy in overall. We report novel stack structure for MgO_x-based MTJ to assure acceptable magnetotransport properties: insertion of preferred-grain-growth-promotion (PGGP) seed layer and bi-layered ferromagnetic pinned layer (bi-PL) to induce preferred grain growth in MgO_x and crystallization of CoFeB layers at higher temperature annealing. Microstructure analysis confirms highly crystalline MgO_x in pseudo-epitaxy with fully crystallized CoFeB via PGGP by high temperature annealing, attributed to enhanced thermal stability of bi-PL. Tunneling magnetoresistance (TMR) 132.6% at resistance-area product (RA) 1.2Ωμm~2 and 253% at 5.9Ωμm~2 from novel MTJ stack successfully satisfy specifications for spintronics devices.
机译:尽管与大规模生产具有优异的兼容性,但通过氧化工艺(MgO_x)制备的具有MgO势垒的磁隧道结(MTJ)对于自旋电子器件的正常运行已显示出不可接受的磁传输性能,因为不良的MgO_x晶体无法正确提供非晶CoFeB层结晶的模板,因此总体上缺乏伪表位。我们报告基于MgO_x的MTJ的新颖堆栈结构,以确保可接受的磁传输性能:插入首选晶粒生长促进(PGGP)种子层和双层铁磁钉扎层(bi-PL)以诱导MgO_x中优选的晶粒生长CoFeB层在较高温度下退火的结晶。显微组织分析证实了伪外延中的高结晶MgO_x与通过PGGP通过高温退火而完全结晶的CoFeB一起,是由于Bi-PL的热稳定性增强所致。新型MTJ叠层的隧道磁阻(TMR)在电阻面积乘积(RA)为1.2Ωμm〜2时为132.6%,在5.9Ωμm〜2时为253%,成功满足了自旋电子器件的规范。

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  • 来源
    《Japanese journal of applied physics》 |2009年第12期|120214.1-120214.3|共3页
  • 作者单位

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

    Electronic Devices Engineering Headquarters, Canon ANELVA Corporation, Kawasaki 215-8550 Japan;

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