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The optimisation of the single surface mount device placement machine in printed circuit board assembly: a survey

机译:印刷电路板组装中单表面贴装设备放置机的优化:一项调查

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摘要

This article surveys research on the single surface mount device (SMD) placement machine optimisation problem. We classify the optimisation problem into five sub-problems: feeder setup, component placement sequencing, nozzle optimisation, component retrieval plan and motion control; and analyse issues relevant to each of these. One of the aims of this article is to provide guidance to other researchers and gain a deeper understanding of the various optimisation issues that arise in this domain. This could lead to the design of improved heuristics, which are more appropriate to the real-world scheduling problem of the SMD placement machine.
机译:本文概述了有关单表面贴装设备(SMD)贴装机优化问题的研究。我们将优化问题分为五个子问题:进料器设置,组件放置顺序,喷嘴优化,组件取回计划和运动控制。并分析与每个问题相关的问题。本文的目的之一是为其他研究人员提供指导,并加深对这一领域出现的各种优化问题的理解。这可能会导致改进的启发式设计,这更适合SMD贴装机的实际调度问题。

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