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Design of a sampling strategy for measuring and compensating for overlay errors in semiconductor manufacturing

机译:设计用于测量和补偿半导体制造中重叠误差的采样策略

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摘要

To enhance the resolution and alignment accuracy in semiconductor manufacturing, it is important to measure overlay errors and control them into the tolerances by removing assignable causes. A number of related studies have been done to examine the factors causing the overlay errors, to propose mathematical models and to develop overlay error control methods. However, the involved sampling strategies received little attention. This study aimed to propose specific designs of sampling patterns effectively to measure and compensate for overlay errors within the limited number of samples in practice. To verify the validity of the proposed approach, the sampling strategies were compared using empirical data from a wafer fabrication facility. The proposed sampling patterns had a higher goodness of fit for the overlay model and lower residuals after compensation. This paper concludes with our findings and discussions on further research.
机译:为了提高半导体制造中的分辨率和对准精度,重要的是测量重叠误差,并通过消除可分配的原因将其控制在公差范围内。已经进行了许多相关研究来检查引起重叠误差的因素,提出数学模型并开发重叠误差控制方法。但是,涉及的采样策略很少受到关注。这项研究旨在提出具体的采样模式设计,以有效地测量和补偿实际数量有限的样本中的重叠误差。为了验证所提出方法的有效性,使用了来自晶圆制造厂的经验数据对采样策略进行了比较。提出的采样模式对覆盖模型具有较高的拟合优度,并且补偿后的残差较低。本文以我们的发现和对进一步研究的讨论作为结束。

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