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Minimising total completion time on single-machine scheduling with new integrated maintenance activities

机译:通过新的集成维护活动,最大程度地减少了单机调度的总完成时间

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摘要

A single-machine scheduling problem with new maintenance activities is examined in this paper. In the scheduling literature, it is often assumed that the interval between maintenance activities is fixed or within a specified time frame. However, this assumption may not hold true in many real-world situations, such as the maintenance activities in wafer manufacturing of semiconductor. Before the wafer manufacturing process starts, it is imperative that the wafers go through a number of cleaning operations to avoid contamination. Using a cleaning agent as the main material of wafer cleaning, the contamination will be dissolved and removed from wafer surface. In case of contamination being accumulated substantial and going beyond a permitted value, the cleaning agent is highly likely to damage the wafer surfaces. Thus, the interval between maintenance activities in the wafer manufacturing process is deemed irregular. The objective function of the proposed problem is to minimise total completion time. Addressing the problem, a binary integer programming model is formulated in this paper. Furthermore, with the research problem being NP-hard, a heuristic based on two special properties is proposed to address the problem. To evaluate and validate the proposed heuristic, a new lower bound is further developed. Extensive experiments have been conducted showing that the proposed heuristic efficiently yields a near-optimal solution with an average percentage error of 15.4 from lower bound.
机译:本文研究了具有新维护活动的单机调度问题。在调度文献中,通常假定维护活动之间的间隔是固定的或在指定的时间范围内。但是,这种假设在许多实际情况下可能并不成立,例如半导体晶圆制造中的维护活动。在晶圆制造过程开始之前,必须对晶圆进行多次清洁操作,以避免污染。使用清洁剂作为晶片清洁的主要材料,污染物将被溶解并从晶片表面清除。如果污染物被大量累积并超过允许值,则清洁剂极有可能损坏晶圆表面。因此,晶片制造过程中维护活动之间的间隔被认为是不规则的。提出的问题的目标功能是最大程度地减少总完成时间。针对这一问题,本文提出了一种二进制整数规划模型。此外,由于研究问题是NP难的,提出了一种基于两个特殊性质的启发式方法来解决该问题。为了评估和验证提议的启发式算法,进一步开发了新的下界。已经进行了广泛的实验,表明所提出的启发式方法有效地产生了接近最优的解决方案,其下限的平均百分比误差为15.4。

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