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首页> 外文期刊>International Journal of Microwave and Wireless Technologies >A 31 GHz body-biased configurable power amplifier in 28 nm FD-SOI CMOS for 5 G applications
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A 31 GHz body-biased configurable power amplifier in 28 nm FD-SOI CMOS for 5 G applications

机译:A 28 NM FD-SOI CMOS中的31 GHz Body-偏置可配置功率放大器,可为5 G应用

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This paper presents a 31 GHz integrated power amplifier (PA) in 28 nm Fully Depleted Silicon-On-Insulator Complementary Metal Oxide Semiconductor (FD-SOI CMOS) technology and targeting SoC implementation for 5 G applications. Fine-grain wide range power control with more than 10 dB tuning range is enabled by body biasing feature while the design improves voltage standing wave ratio (VSWR) robustness, stability and reverse isolation by using optimized 90 degrees hybrid couplers and capacitive neutralization on both stages. Maximum power gain of 32.6 dB, PAE(max) of 25.5% and P-sat of 17.9 dBm are measured while robustness to industrial temperature range and process spread is demonstrated. Temperature-induced performance variation compensation, as well as amplitude-to-phase modulation (AM-PM) optimization regarding output power back-off, are achieved through body-bias node. This PA exhibits an International Technology Roadmap for Semiconductors figure of merit (ITRS FOM) of 26 925, the highest reported around 30 GHz to authors' knowledge.
机译:本文介绍了31 GHz集成功率放大器(PA)28 nm完全耗尽的绝缘体互补金属氧化物半导体(FD-SOI CMOS)技术,并针对5g应用的靶向SOC实现。通过使用超过10dB调谐范围的细粒型宽范围功率控制通过身体偏置功能使得设计通过使用优化的90度混合耦合器和两个阶段的电容中和来提高电压驻波比(VSWR)稳健性,稳定性和反向隔离。 。测量最大功率增益为32.6 dB,PAE(MAX)为25.5%,P-SAT为17.9 dBm,而工业温度范围和工艺差的稳健性则测量。温度诱导的性能变化补偿以及关于输出电源回退的幅度调制(AM-PM)优化,通过Body-Bias节点实现。该PA展示了一个国际技术路线图,适用于半导体的Merit(ITRS FOM)的数字技术路线图,为26 925,最高报告大约30 GHz到作者的知识。

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