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Fabrication and capillary performance of a novel composite wick for ultra-thin heat pipes

机译:超薄热管新型复合芯的制造和毛细管性能

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摘要

The rapid development of high-performance portable electronics requires ultra-thin heat pipes (UTHPs) with higher heat transfer capacity to meet their heat dissipation needs. Wick structure, the key component of a heat pipe, makes a decisive role in the heat transfer capacity of the heat pipe. However, since the wall thickness of UTHPs is typically < 0.1 mm, it is difficult to machine deep enough grooves on the shell to increase the permeability of the wicks like conventional heat pipes. Therefore, a novel composite wick structure with high permeability for UTHPs is proposed in this study. It is found that the wick with larger pores formed by parallel woven spiral meshes have higher permeability, resulting in more working fluid in the wick, which helps delay the drying out at the evaporation end of heat pipes. To further improve the capillary performance of wicks, the effect of thermal oxidation suitable for mass production on the capillary pumping performance of wicks is systematically studied for the first time. Compared with the single sintered wick, the capillary rise height after oxidation at 400 °C, 500 °C, 600 °C, and 700 °C for 150 min increased by about 32.2%, 19%, 19.5%, and 12.9%, respectively. Considering that the copper oxidation may limit the choice of working fluid for the heat pipe, the wicks are heated to 400 °C for reduction reaction for 1 h (with 95% N_2+5% H_2 gas). The results show that the capillary rise height of the wicks after oxidation at 400 °C, 500 °C, 600 °C, and 700 °C and reduction treatment is about 110%, 127%, 114%, and 91.4% of that of the single sintered wick, respectively. The experimental results show that the maximum heat load power of the UTVCs with 5 layers #200 mesh, single sintered composite wick and 500 °C oxidation-reduction wick are 16 W, 29 W and 38 W, respectively.
机译:高性能便携式电子设备的快速发展需要超薄热管(UTHPS),传热能力较高,以满足其散热需求。芯结构是热管的关键部件,在热管的传热容量中作出了决定性作用。然而,由于UTHP的壁厚通常<0.1mm,因此难以在壳体上加工足够的足够凹槽以增加玻璃的渗透性,如常规热管。因此,本研究提出了一种具有高渗透性的新型复合芯结构。结果发现,通过平行织造螺旋网形成的孔具有较大孔的芯片具有较高的渗透性,导致芯中的更加工作流体,这有助于在热管的蒸发端延迟干燥。为了进一步提高芯片的毛细管性能,系统地研究了适用于批量生产的热氧化对芯片的毛细管泵送性能的影响。与单次烧结芯相比,氧化在400℃,500℃,600℃和700℃下氧化后的毛细管上升高度150分钟,分别增加约32.2%,19%,19.5%和12.9% 。考虑到铜氧化可能限制用于热管的工作流体的选择,将芯片加热至400℃以进行1小时的还原反应(具有95%N_2 + 5%H_2气体)。结果表明,400℃,500℃,600℃和700°C和减少治疗氧化后的芯片的毛细管上升高度约为110%,127%,114%和91.4%单个烧结芯。实验结果表明,具有5层#200目,单烧结复合芯和500℃氧化还原芯的UTVC的最大热负荷功率分别为16W,29W和38W。

著录项

  • 来源
    《International Journal of Heat and Mass Transfer》 |2021年第9期|121467.1-121467.14|共14页
  • 作者单位

    School of Mechanical and Automotive Engineering South China University of Technology Guangzhou 510647 China;

    School of Mechanical and Automotive Engineering South China University of Technology Guangzhou 510647 China;

    School of Mechanical and Automotive Engineering South China University of Technology Guangzhou 510647 China;

    School of Mechanical and Automotive Engineering South China University of Technology Guangzhou 510647 China;

    Guangdong NewIdea Technology co. LTD. Guangzhou 510520 China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Composite wick; Oxidation; Reduction; Capillary performance; Ultra-thin heat pipe;

    机译:复合芯;氧化;减少;毛细管性能;超薄热管;

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