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首页> 外文期刊>International Journal of Heat and Mass Transfer >Numerical prediction of thermal contact resistance of 3D C/C-SiC needled composites based on measured practical topography
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Numerical prediction of thermal contact resistance of 3D C/C-SiC needled composites based on measured practical topography

机译:基于实测形貌的3D C / C-SiC针刺复合材料热接触电阻的数值预测

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摘要

The 3D C/C-SiC composite is a kind of widely used material in thermal protection system or other functional parts of the hypersonic vehicles. This paper conducts numerical simulation to predict the thermal contact resistance of the 3D C/C-SiC needled composite pairs. The practical surface topography is measured by a 3D optical microscope named Bruker Contour GT-K, and the rough surfaces for simulation are reconstructed in ANSA software with the help of Python code. The measured arithmetical mean roughness (Ra) of the two specimens are 12.04 mu m and 11.75 mu m respectively. The prediction is divided into two steps, static analysis for revealing the contact spot distribution of the contact interfaces, and thermal analysis for the temperature distribution of the contact interfaces to calculate the thermal contact resistance. Both two steps are finished with Abaqus. The prediction results show that actual contact area only occupies a small part of nominal contact area (when pressure is 5.52 MPa, the actual contact area just accounts for 7% of the nominal contact area), and the dependency curve approximately shows linearity between the proportion of actual contact area to nominal contact area and loading ressure. Besides, thermal contact resistance decreases with an increase in loading pressure and temperature. Thermal contact resistances of the studied composite materials are in the order of 6 x 10(-4)-1.2 x 10(-3) K.m(2.)w(-1). (C) 2018 Elsevier Ltd. All rights reserved.
机译:3D C / C-SiC复合材料是一种广泛用于热保护系统或超音速飞行器其他功能部件的材料。本文进行了数值模拟,以预测3D C / C-SiC针刺复合材料对的热接触电阻。实际的表面形貌通过名为Bruker Contour GT-K的3D光学显微镜进行测量,并借助Python代码在ANSA软件中重建用于仿真的粗糙表面。测得的两个样品的算术平均粗糙度(Ra)分别为12.04μm和11.75μm。该预测分为两个步骤:静态分析(用于显示接触界面的接触点分布)和热分析(用于分析接触界面的温度分布),以计算热接触电阻。这两个步骤都通过Abaqus完成。预测结果表明,实际接触面积仅占标称接触面积的一小部分(当压力为5.52 MPa时,实际接触面积仅占标称接触面积的7%),并且相关曲线大致显示出比例之间的线性关系实际接触面积与额定接触面积之比,并确保负载。此外,随着负载压力和温度的增加,热接触电阻减小。研究的复合材料的热接触电阻约为6 x 10(-4)-1.2 x 10(-3)K.m(2.)w(-1)。 (C)2018 Elsevier Ltd.保留所有权利。

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  • 作者单位

    Xi An Jiao Tong Univ, Sch Energy & Power Engn, Key Lab Thermofluid Sci & Engn, MOE, Xian 710049, Shaanxi, Peoples R China;

    Xi An Jiao Tong Univ, Sch Energy & Power Engn, Key Lab Thermofluid Sci & Engn, MOE, Xian 710049, Shaanxi, Peoples R China;

    Northwestern Polytech Univ, Sch Astronaut, Shaanxi Aerosp Flight Vehicle Key Lab, Xian 710072, Shaanxi, Peoples R China;

    Xi An Jiao Tong Univ, Sch Energy & Power Engn, Key Lab Thermofluid Sci & Engn, MOE, Xian 710049, Shaanxi, Peoples R China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Numerical prediction; C/C-SiC composite; Thermal contact resistance;

    机译:数值预测;C / C-SiC复合材料;热接触电阻;

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