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Monte carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks

机译:受到冲击的多晶硅MEMS中微裂纹的蒙特卡洛模拟

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In this work we exploit a multi-scale framework to model the shock-induced failure of polysilicon micro electro-mechanical systems (MEMS), and study the impact of uncertainties at polycrystal length-scale on the results. Because of polysilicon brittleness, MEMS sensors almost instantaneously fail by micro-cracking when subjected to shocks. Since the length of the zone where such micro-cracking is spreading can amount to 5–10% of the characteristic grain size, the morphology of polysilicon films constituting the movable parts of the MEMS is explicitly modeled at the micro-scale within a cohesive approach. Focusing on shocks induced by accidental drops, forecasts of MEMS failure are obtained through a Monte Carlo methodology, wherein statistics of the polycrystalline morphology are accounted for. Outcomes, in terms of failure mode and drop height leading to failure, are shown to correctly represent available experimental evidences relevant to a commercial micro-device.
机译:在这项工作中,我们利用多尺度框架对多晶硅微机电系统(MEMS)的振动诱发的失效进行建模,并研究多晶长度尺度上的不确定性对结果的影响。由于多晶硅的脆性,MEMS传感器在遭受冲击时几乎瞬间会因微裂纹而失效。由于这种微裂纹扩展的区域的长度可以达到特征晶粒尺寸的5–10%,因此,通过内聚方法,可以在微观尺度上对构成MEMS可移动部件的多晶硅膜的形态进行显式建模。 。着眼于意外跌落引起的冲击,通过蒙特卡洛方法获得了MEMS故障的预测,其中考虑了多晶形态的统计数据。结果表明,根据失败模式和导致失败的跌落高度得出的结果正确代表了与商用微型设备相关的可用实验证据。

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