机译:激光冲击喷丸引起的残余应力及其对裂纹扩展行为的影响
Department of Mechanical Engineering, University of Akron, Akron, OH 44325, USA;
Department of Mechanical Engineering, University of Akron, Akron, OH 44325, USA;
Department of Mechanical Engineering, University of Akron, Akron, OH 44325, USA;
Laser shock peening (LSP); Finite element method; Residual stress; Peening patterns; Stress intensity factor; Johnson-Cook;
机译:激光冲击诱导残余应力下疲劳裂纹生长的相位场建模
机译:激光冲击喷丸残余应力对疲劳裂纹扩展的影响
机译:经过实验验证的多步模拟策略可预测激光冲击喷丸后残余应力场中的疲劳裂纹扩展速率
机译:喷丸引起的残余应力对裂纹扩展的影响
机译:激光喷丸模拟引起的残余应力的不确定度量化。
机译:SICP / 2009AL复合材料激光冲击喷丸:微观结构演化残余应力和疲劳行为
机译:激光冲击喷丸产生的残余应力对疲劳裂纹扩展的影响
机译:激光冲击强化过程中残余应力水平和效应的测量与认识