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首页> 外文期刊>International journal of applied ceramic technology >Residual Stress Distribution and Characterization on Multi-Curved Armor Tiles
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Residual Stress Distribution and Characterization on Multi-Curved Armor Tiles

机译:多弯曲铠装砖的残余应力分布和特征

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摘要

Residual stresses were measured on numerous multi-curved, ballistic tiles made from either silicon carbide or boron carbide. Residual stresses were measured at 155 locations to determine what affect parameters such as material, material processing, tile geometry, and manufacturer had on residual stress type and magnitude. 23% of data points had tensile residual stress. The highest residual stresses were measured in tiles with either the largest surface area or smallest plate thickness. Higher stresses were measured in silicon carbide tiles compared with boron carbide tiles. Residual stresses in tiles consolidated by hot pressing measured on average 10 MPa higher than those by pressureless sintering.
机译:在许多由碳化硅或碳化硼制成的多弯曲弹道砖上测量残余应力。在155个位置上测量残余应力,以确定诸如材料,材料加工,瓷砖几何形状和制造商等参数对残余应力类型和大小的影响。 23%的数据点具有拉伸残余应力。在具有最大表面积或最小板厚度的瓷砖中测量了最高的残余应力。与碳化硼瓷砖相比,碳化硅瓷砖测得的应力更高。通过热压加固的瓷砖中的残余应力平均比无压烧结的残余应力高10 MPa。

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    Mechanical Engineering Department, Oakland University, Rochester, Michigan 48309;

    Mechanical Engineering Department, Oakland University, Rochester, Michigan 48309;

    Mechanical Engineering Department, Oakland University, Rochester, Michigan 48309;

    Program Executive Office-Soldier, Fort Belvoir, Virginia 22060;

    Program Executive Office-Soldier, Fort Belvoir, Virginia 22060;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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