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Bindt Launches Conference Attendance Award

机译:Bindt启动会议出席奖

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The British Institute of NDT (BINDT) has created a scheme to support individuals from overseas who would make a positive contribution to its annual conference but are unable to attend due to financial constraints. The scheme, entitled The Conference Attendance Award, has been allocated direct Institute funding with the aim of encouraging attendance at the BINDT annual conference by contributors from foreign nations. The award is intended for individuals from the profession of NDT who wish to attend the conference but are unable to do so due to financial constraints. Applicants can range from individuals at an early career stage or be experiencedrncontributors who are unable to attend due to restricted finance.rnThe opportunity for applying for the award will be given to contributors who have had their papers accepted by the Technical Committee and have requested an application form (see below). The award will be in operation for the NDT 2009 Conference in Blackpool. BINDT's Technical Committee will administer the award and it is expected that one grant will be available annually.
机译:英国无损检测研究所(BINDT)制定了一项计划,以支持来自海外的个人,这些个人将为其年度会议做出积极贡献,但由于经济拮据而无法参加。该计划名为“会议出席奖”,已获得研究所的直接资助,目的是鼓励来自国外的参与者参加BINDT年度会议。该奖项旨在奖励那些希望参加会议但由于经济拮据而无法参加会议的无损检测专业人士。申请者的范围可以是职业初期的个人,也可以是经验丰富的-由于资金有限而无法参加的贡献者。-申请奖项的机会将提供给已被技术委员会接受其论文并要求申请的贡献者。表格(见下文)。该奖项将在布莱克浦举行的NDT 2009大会上进行。 BINDT的技术委员会将负责管理该奖项,预计每年将提供一笔拨款。

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    《Insight》 |2009年第4期|182|共1页
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  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《化学文摘》(CA);
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  • 正文语种 eng
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