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Handsets go 'lead-free'

机译:手机“无铅”

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摘要

Worldwide efforts to eliminate the perceived problem of toxic materials from electronic products has caught up with GaAs chip producers. However ironic it may seem, the attention is not directed at the Group V elements found in the chips but rather the lead in the solder interconnect. 'Lead-free' has become the watchword of the electronics manufacturing industry. It gained particular emphasis when Intel recently stated that it too was working on such processes. This was hardly news since it has been a preoccupation of the industry for around a decade. The III-Vs industry has also been busy dealing with the new regulations and the latest products likely have the first of the lead-free MMIC modules in them. Perhaps soon handsets and their like might display stickers proclaiming this. Such is the power of marketing that a cachet like this might get you ahead of the competition. In down-to-earth practical terms the upshot is that every single component in a handset must comply with the lead-free environmental directive. RF module makers too must now switch away from the lead-tin solders they have been using for years to exotic alloys containing bismuth and so on.
机译:GaAs芯片生产商已在全球范围内努力消除电子产品中有毒物质这一已知问题。不管看起来多么具有讽刺意味,关注的重点并不在于芯片中的V组元素,而在于焊料互连中的铅。 “无铅”已成为电子制造业的口号。当英特尔最近表示自己也在从事此类流程时,它特别受到重视。这几乎已经不是新闻了,因为它已经成为该行业近十年的头等大事。 III-Vs行业也一直在忙于处理新法规,最新产品中可能包含第一个无铅MMIC模块。也许不久之后,手机及其类似产品可能会贴上标语来表明这一点。如此强大的营销才能使您在竞争中脱颖而出。用务实的话来说,结果是手机中的每个组件都必须符合无铅环境指令。射频模块制造商现在也必须从多年来使用的铅锡焊料转换为含铋等奇特的合金。

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