Soitech works with Sez on Ge removal and Veeco for MBE and GaN

摘要

The Soitec and SEZ Groups have initiated a joint program to speedup industrialisation of next-generation strained sili-con-on-insulator (sSOI) substrates. The companies will leverage Soitec's focus in engineered substrates and SEZ's strength in single-wafer, wet-processing technology to develop a new wet-etch processes designed to optimise total germanium removal in sSOI manufacturing.