Freescale's packaging revolution

摘要

Anyone putting the terms "Freescale" and "semiconductor packaging" through the US patents database search will be greeted with a tsunami of 48 patent applications on as many packaging issues, filed since January 2005. So it comes as no surprise that Freescale's new Redistributed Chip Packaging (RCP) technology is based on some 13 patents, three of them new and the remainder to be granted soon.