Maturing and diversifying

摘要

This issue must start with a thank you and fond farewell to the outgoing editor, Gail Purvis, for her dedicated stewardship of III-Vs Review over the past three years. Those familiar with this magazine several years ago may remember my previous editorship of III-Vs Review from 2000 to 2002. That period was characterised by rapid spread in the penetration of both mobile and fibre-optic telecoms, fuelling extensive development of III-Vs manufacturing - in both volume and technology - such as the transition from 4″to 6″ GaAs wafers for radio-frequency ICs and from 2″ to 3″ and 4″ InP wafers for optoelectronics, as well as outsourcing to epiwafer and device foundries. However, subsequent overcapacity led to retrenchment.