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Semiconductor hardnut

机译:半导体硬核

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Silicon carbide (SiC) has been proposed for some time as a substrate for high-speed, high-temperature devices, and products are now entering the market. Dr Mike Cooke reviews some of SiC's device opportunities and tough process challenges. There's something strange about a material in which one proposal for etch processing is to use molten salt fluxes in platinum beakers. But again, everything about using silicon carbide is hard. Indeed, after diamond it is one of the hardest materials known to humanity. A quick perusal of the process technology challenges for SiC device production impresses one with the 'simplicity' of pure silicon or Ⅲ-Ⅴ IC production. While for some researchers the very difficulty of making SiC work as a semiconductor material is possibly what attracts, for others it is the potential thermal and electrical benefits of the compound.
机译:碳化硅(SiC)一直被提出作为高速,高温设备的衬底,并且产品现已进入市场。 Mike Cooke博士回顾了SiC的一些器件机遇和艰巨的工艺挑战。关于一种材料,其中一种蚀刻处理建议是在铂烧杯中使用熔融盐熔剂,这有些奇怪。但是同样,关于使用碳化硅的一切都很难。确实,在钻石之后,它是人类已知的最坚硬的材料之一。快速浏览SiC器件生产所面临的工艺技术挑战,给人以“简单”的纯硅或Ⅲ-ⅤIC生产的印象。虽然对于某些研究人员来说,吸引SiC作为半导体材料的工作非常困难,但是对于另一些研究人员来说,则是该化合物潜在的热学和电学益处。

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