机译:3D集成技术概述和批量生产面临的挑战
Dept. of Bioengineering and Robotics, Tohoku Univ. 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai 980-8579, Japan;
Dept. of Biomedical Engineering, Tohoku Univ. 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai 980-8579, Japan;
Dept. of Biomedical Engineering, Tohoku Univ. 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai 980-8579, Japan;
Dept. of Bioengineering and Robotics, Tohoku Univ. 6-6-01 Aramaki Aza Aoba, Aoba-ku, Sendai 980-8579, Japan;
3D LSI; TSV(through silicon via); Micro-bumping; Thermo-mechanical Stress; Cu contamination;
机译:3D集成技术概述和批量生产面临的挑战
机译:3D集成技术概述和批量生产面临的挑战
机译:3D集成技术概述和批量生产面临的挑战
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