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首页> 外文期刊>Ultrasonics, Ferroelectrics and Frequency Control, IEEE Transactions on >1.05-GHz CMOS oscillator based on lateral- field-excited piezoelectric AlN contour- mode MEMS resonators
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1.05-GHz CMOS oscillator based on lateral- field-excited piezoelectric AlN contour- mode MEMS resonators

机译:基于横向场激励压电AlN轮廓模式MEMS谐振器的1.05-GHz CMOS振荡器

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This paper reports on the first demonstration of a 1.05-GHz microelectromechanical (MEMS) oscillator based on lateral-field-excited (LFE) piezoelectric AlN contourmode resonators. The oscillator shows a phase noise level of -81 dBc/Hz at 1-kHz offset frequency and a phase noise floor of -146 dBc/Hz, which satisfies the global system for mobile communications (GSM) requirements for ultra-high frequency (UHF) local oscillators (LO). The circuit was fabricated in the AMI semiconductor (AMIS) 0.5-¿m complementary metaloxide- semiconductor (CMOS) process, with the oscillator core consuming only 3.5 mW DC power. The device overall performance has the best figure-of-merit (FoM) when compared with other gigahertz oscillators that are based on film bulk acoustic resonator (FBAR), surface acoustic wave (SAW), and CMOS on-chip inductor and capacitor (CMOS LC) technologies. A simple 2-mask process was used to fabricate the LFE AlN resonators operating between 843 MHz and 1.64 GHz with simultaneously high Q (up to 2,200) and kt 2 (up to 1.2%). This process further relaxes manufacturing tolerances and improves yield. All these advantages make these devices suitable for post-CMOS integrated on-chip direct gigahertz frequency synthesis in reconfigurable multiband wireless communications.
机译:本文报道了基于横向场激励(LFE)压电AlN轮廓模式谐振器的1.05 GHz微机电(MEMS)振荡器的首次演示。该振荡器在1kHz偏移频率下显示出-81 dBc / Hz的相位噪声电平,在-146 dBc / Hz的本底噪声,满足了全球移动通信系统(GSM)对超高频(UHF)的要求)本地振荡器(LO)。该电路是采用AMI半导体(AMIS)0.5 µm互补金属氧化物半导体(CMOS)工艺制造的,振荡器内核仅消耗3.5 mW的DC功率。与其他基于薄膜体声谐振器(FBAR),表面声波(SAW)以及CMOS片上电感器和电容器(CMOS)的千兆赫振荡器相比,该器件的整体性能具有最佳的品质因数(FoM)。 LC)技术。使用简单的2掩模工艺来制造LFE AlN谐振器,该谐振器在843 MHz和1.64 GHz之间工作,同时具有高Q(高达2,200)和kt 2(高达1.2%)。此过程进一步放松了制造公差并提高了产量。所有这些优点使这些设备适用于可重构多频带无线通信中的后CMOS集成片上直接千兆赫频率合成。

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