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A statistical method for obtaining the factors in electronic-component reliability-prediction models

机译:获取电子元件可靠性预测模型中因素的统计方法

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摘要

According to US Mil-Hdbk-217, the failure rate of most electronic components can be predicted as lambda /sub p/= lambda /sub b/* pi /sub 1/* pi /sub 2/... pi /sub n/. A statistical method of obtaining these parameters is presented. The method is based on large quantities of field data, and the more current the data are, the more accurate the values of each level of lambda /sub b/ and pi /sub i/. Using these values, the models in US Mil-Hdbk-217 can be applied to predict the life of electronic products. The method can also be used to verify the present values of each level of lambda /sub b/ and pi /sub i/, and to provide the basis of further amendment.
机译:根据US Mil-Hdbk-217,大多数电子组件的故障率可以预测为lambda / sub p / = lambda / sub b / * pi / sub 1 / * pi / sub 2 / ... pi / sub n /。介绍了获得这些参数的统计方法。该方法基于大量的现场数据,并且数据越多,λ/ sub b /和pi / sub i /的每个级别的值越准确。使用这些值,可以将US Mil-Hdbk-217中的模型应用于预测电子产品的寿命。该方法还可用于验证λ/ sub b /和pi / sub i /的每个水平的当前值,并提供进一步修正的基础。

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