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An Experimental Evaluation of SiC Switches in Soft-Switching Converters

机译:软开关转换器中SiC开关的实验评估

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Soft-switching converters equipped with insulated gate bipolar transistors (IGBTs) in silicon (Si) have to be dimensioned with respect to additional losses due to the dynamic conduction losses originating from the conductivity modulation lag. Replacing the IGBTs with emerging silicon carbide (SiC) transistors could reduce not only the dynamic conduction losses but also other loss components of the IGBTs. In the present paper, therefore, several types of SiC transistors are compared to a state-of-the-art 1200-V Si IGBT. First, the conduction losses with sinusoidal current at a fixed amplitude (150 A) are investigated at different frequencies up to 200 kHz. It was found that the SiC transistors showed no signs of dynamic conduction losses in the studied frequency range. Second, the SiC transistors were compared to the Si IGBT in a realistic soft-switching converter test system. Using a calorimetric approach, it was found that all SiC transistors showed loss reductions of more than 50%. In some cases loss reductions of 65% were achieved even if the chip area of the SiC transistor was only 11% of that of the Si IGBT. It was concluded that by increasing the chip area to a third of the Si IGBT, the SiC vertical trench junction field-effect transistor could yield a loss reduction of approximately 90%. The reverse conduction capability of the channel of unipolar devices is also identified to be an important property for loss reductions. A majority of the new SiC devices are challenging from a gate/base driver point-of-view. This aspect must also be taken into consideration when making new designs of soft-switching converters using new SiC transistors.
机译:由于来自电导率调制滞后的动态导通损耗,必须针对附加损耗来确定在硅(Si)中配备有绝缘栅双极晶体管(IGBT)的软开关转换器的尺寸。用新兴的碳化硅(SiC)晶体管代替IGBT不仅可以减少动态传导损耗,而且可以减少IGBT的其他损耗分量。因此,在本文中,将几种类型的SiC晶体管与最新的1200V Si IGBT进行了比较。首先,在高达200 kHz的不同频率下,以固定幅度(150 A)的正弦电流测量传导损耗。发现在所研究的频率范围内,SiC晶体管未显示出动态传导损耗的迹象。其次,在实际的软开关转换器测试系统中,将SiC晶体管与Si IGBT进行了比较。使用量热法,发现所有SiC晶体管的损耗降低均超过50%。在某些情况下,即使SiC晶体管的芯片面积仅为Si IGBT的芯片面积的11%,也可以实现65%的损耗降低。结论是,通过将芯片面积增加到Si IGBT的三分之一,SiC垂直沟槽结场效应晶体管可以减少大约90%的损耗。单极器件通道的反向传导能力也被认为是减少损耗的重要特性。从栅极/基极驱动器的角度来看,大多数新型SiC器件都具有挑战性。在使用新的SiC晶体管进行软开关转换器的新设计时,也必须考虑这一方面。

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