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A Survey of Wide Bandgap Power Semiconductor Devices

机译:宽带隙功率半导体器件调查

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Wide bandgap semiconductors show superior material properties enabling potential power device operation at higher temperatures, voltages, and switching speeds than current Si technology. As a result, a new generation of power devices is being developed for power converter applications in which traditional Si power devices show limited operation. The use of these new power semiconductor devices will allow both an important improvement in the performance of existing power converters and the development of new power converters, accounting for an increase in the efficiency of the electric energy transformations and a more rational use of the electric energy. At present, SiC and GaN are the more promising semiconductor materials for these new power devices as a consequence of their outstanding properties, commercial availability of starting material, and maturity of their technological processes. This paper presents a review of recent progresses in the development of SiC- and GaN-based power semiconductor devices together with an overall view of the state of the art of this new device generation.
机译:宽带隙半导体具有卓越的材料性能,与当前的硅技术相比,能够在更高的温度,电压和开关速度下潜在地运行功率器件。结果,正在开发用于功率转换器应用的新一代功率器件,其中传统的Si功率器件显示出有限的操作。这些新的功率半导体器件的使用将既可以显着提高现有功率转换器的性能,又可以开发新的功率转换器,从而可以提高电能转换的效率并更合理地利用电能。目前,由于其优异的性能,原材料的商业可得性以及其工艺流程的成熟,SiC和GaN是这些新型功率器件中最有前途的半导体材料。本文介绍了基于SiC和GaN的功率半导体器件开发的最新进展,并对这种新型器件的发展现状进行了全面的介绍。

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