机译:了解重复短路应力下P-GaN HEMT的电气参数降解
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
Southeast Univ Natl ASIC Syst Engn Res Ctr Nanjing 210096 Peoples R China;
WUXI NCE Power Co Ltd Wuxi 214028 Jiangsu Peoples R China;
WUXI NCE Power Co Ltd Wuxi 214028 Jiangsu Peoples R China;
Huahong Semicond Ltd Wuxi 214028 Jiangsu Peoples R China;
Stress; Logic gates; Degradation; HEMTs; Capacitance; Temperature measurement; Wide band gap semiconductors; Electrical parameter degradations; P-GaN high electron mobility transistor (HEMT); repetitive short circuit;
机译:重复UIS应力下P-GaN HEMT的电参数降解的研究
机译:重复短路应力下基于低频噪声的基于低频噪声的陷阱和恢复特性分析
机译:反复短路应力下SiC功率MOSFET的电参数劣化的综合分析
机译:重复ESD应力下600V SOI-LIGBT的电参数劣化研究
机译:研究常关模式的AlGaN / GaN MOS HEMT器件,该器件利用栅极后退和p-GaN栅极结构以及带有醛生长的高k栅极绝缘体来实现高功率应用。
机译:不同修复方法对常关P-GaN HEMT电性能的影响
机译:P-GaN门常关下锚杆近均匀菌株对电气特性的模拟
机译:晶体硅短路电流降解研究:初步结果。